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IC Dispensing Machine

Htc provide automatic precision dispenser Bonding of BEOL and IC snap cure oven, Widely used in IC dispensing packaging, optoelectronics, LCD / LED dispensing package. Graphical user interface easy to learn and easy to use, convenient and capacity management.

Product Case

IC Snap Cure Oven SC-904-XP

Vacuum Snap Cure Oven VSC-1904-S-XP

IC Snap Cure Oven SC-904-XP

Feature
Fully automatic curing system for fast-cure glue. Easy to connect with kinds of Die-Bonder machine. Sutable for different type of packaging without change kits. Dual language(Chinese/English) operation interface and Windows based om MMI, easy to operation.
Application
Die-Bonding and curing process in-line purpose. Die-Bonding process of package Stacking Dies Pre-Heating/Pre-Heating of Flip-Chip Under-Fill process.
Specifications
Substrate	120~260(W)x 45~90(D)mm
Throughput	720 ea/hour (Curing Time 3sec + Index Time)
Heating	PID Control Curing Stations
Transfer	Wire / Strip Indexer
Magazine	Max. 270(W)x 90(D)x 160(H)mm
Facilities	220 VAC / 1 Phase/60Hz, Air: 5kg/cm2(min.)
Dimensions	Ref. 1130(W) x 1270(D) x 1640(H) mm
Weight	Approx. 650kg