IC Dispensing Machine
Htc provide automatic precision dispenser Bonding of BEOL and IC snap cure oven, Widely used in IC dispensing packaging, optoelectronics, LCD / LED dispensing package. Graphical user interface easy to learn and easy to use, convenient and capacity management.
IC Snap Cure Oven SC-904-XP


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Application |
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Specifications |
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Substrate |
120~260(W)x 45~90(D)mm |
Throughput |
720 ea/hour (Curing Time 3sec + Index Time) |
Heating |
PID Control Curing Stations |
Transfer |
Wire / Strip Indexer |
Magazine |
Max. 270(W)x 90(D)x 160(H)mm |
Facilities |
220 VAC / 1 Phase/60Hz, Air: 5kg/cm2(min.) |
Dimensions |
Ref. 1130(W) x 1270(D) x 1640(H) mm |
Weight |
Approx. 650kg |